封装资料分享区今日: 0|主题: 51|排名: 3

新窗全部主题最新热门热帖精华更多 \| 显示置顶		作者	回复/查看	最后发表

隐藏置顶帖上海奋芯电子---专业IC版图外包服务精华1	奋芯 2023-4-8	0223	奋芯 2023-4-8 10:59
版块主题
学习小结-半导体封装技术	tenco 2023-5-20	048	tenco 2023-5-20 15:17
上海交大的传统封装学习PPT	tenco 2023-5-20	033	tenco 2023-5-20 15:15
Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages	tenco 2023-5-20	034	tenco 2023-5-20 15:14
封装设计规范进阶级	tenco 2023-5-20	035	tenco 2023-5-20 13:42
IC封装基础与工程设计实例	Zhangsh 2023-5-20	019	Zhangsh 2023-5-20 11:32
Modeling and Simulation for Microelectronic Packaging Assembly	往客 2023-5-20	020	往客 2023-5-20 11:25
Fan-Out Wafer-Level Packaging	往客 2023-5-20	027	往客 2023-5-20 11:07
塑封集成电路环境试验前预处理	lusi 2023-5-20	029	lusi 2023-5-20 08:39
Cadence基本操作培训	lusi 2023-5-20	027	lusi 2023-5-20 08:38
系统级封装SiP 封装设计	lusi 2023-5-20	033	lusi 2023-5-20 08:36
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces	lusi 2023-5-20	024	lusi 2023-5-20 08:33
modeling：analysis design and tests for electronics packaging beyond moore	lusi 2023-5-20	030	lusi 2023-5-20 08:28
Overview and Outlook of 3D IC Packaging, 3D Si Integration, and 3D IC Integration	jiamo 2023-5-20	029	jiamo 2023-5-20 07:16
半导体集成电路外形尺寸	gongyemuji 2023-4-8	0112	gongyemuji 2023-4-8 21:15
JEDEC BALL GRID ARRAY PACKAGE DESIGN REGISTRATION	baiwu 2023-4-7	0103	baiwu 2023-4-7 14:01
The electronic packaging handbook	baiwu 2023-4-7	0106	baiwu 2023-4-7 13:59
芯片背面金属化简要介绍	baiwu 2023-4-7	093	baiwu 2023-4-7 13:58
Status of Advanced Packaging Report 2017_Jun'17	baiwu 2023-4-7	087	baiwu 2023-4-7 13:56
NEW MATERIAL:[01_Prismark_Semiconductor and Packaging Report Q2 2016_Aug'16]	baiwu 2023-4-7	084	baiwu 2023-4-7 13:55
Packaging Trends in IoTs andWearablesn	baiwu 2023-4-7	092	baiwu 2023-4-7 13:54

12 3 / 3 页下一页

返回发新帖

快速发帖

Archiver|手机版|小黑屋|EDA1024技术论坛

GMT+8, 2023-6-4 05:15 , Processed in 0.046411 second(s), 11 queries .

		自动登录	找回密码
密码			立即注册

封装资料分享区 今日: 0|主题: 51|排名: 3

快速发帖

封装资料分享区今日: 0|主题: 51|排名: 3